Electrolytic Copper Foil for Flexible Printed Circuit Boards

Electrolytic Copper Foil for Flexible Printed Circuit Boards

Thickness: 9--70 micron

Product Introduction

Characteristic

• High temperature and high elongation foils annealed and recrystallized by heating, with the highest flexural properties in electrolytic copper foils.

• By fine-coarsening the smooth surface of the base foil, low roughness can also play a good peel strength with the base film.

• A wide range of foil thicknesses.

• High frequency surface treatment (BHM, FX treatment).

Application

• Flexible printed circuit boards

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