Rolled Copper Foil HA, HA-V2 Foil
Application
• FPC for optical pickers
• FPC for HDD
• FPC for LCD modules
• FPC for car
Characteristic
• Designed calendered copper foils with large grains and consistent crystal orientation.
• High flexural property is achieved and cracks are suppressed.
• Significantly improved vibration resistance.
• Low elasticity, achieving "soft" movements.
Product Introduction
Technical content and features
HA, HA-V2 foil crystal structure and excellent various properties
Recrystallization structure
HA and HA-V2 foils are high performance calendered copper foils with excellent bending characteristics (static bending characteristics), sliding buckling characteristics (dynamic bending characteristics), low resilience, softness and vibration resistance by increasing grain size and keeping crystal direction consistent. The grain boundary area, which is the origin point of crack, can be reduced and the crack occurrence can be inhibited by making the grain grow larger after annealing.
Sliding buckling characteristics
HA and HA-V2 foils have higher sliding buckling characteristics than ordinary calendered copper foils. In addition, by providing an extremely thin 9µm copper foil, further miniaturization and thinness of electronic devices can be matched.
Suppleness
The Young's modulus of HA foil is lower than that of ordinary calendered copper foil and special electrolytic copper foil, and has excellent softness.
Low resilience
HA foil is a special calendered copper foil with low resilience and is the most suitable for bending packaging applications.
By using HA foil, the rebound of Flexible Copper Clad Laminate (FCCL) can be inhibited.
Bending resistance
For repeated bending (= bending), HA foil has superior properties than ordinary calendered copper foil. After repeated bending test of FCCL at 180℃, cracks appeared in the special electrolytic copper foil in the second cycle, and TPC foil, HA-V2 foil and HA foil did not appear in the second, fifth and sixth cycles, respectively. Compared with special electrolytic copper foils, HA foils, HA-V2 foils and TPC foils have higher bending advantages.
Vibration resistance
The vibration resistance of FCCL with HA foil at room temperature is about 2 times that of ordinary calended copper foil. It has about 5 times the life of ordinary rolled copper foil at high temperatures (115 ° C), and 3 times the life of thermal cycle tests at -30-115 ° C, maintaining excellent vibration resistance even under harsh conditions.
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