Electrolytic Copper Foil for Rigid Circuit Boards
There are 3 types of electronic copper foil for rigid circuit boards, including JTCSLC, JDLC and CAC (Aluminum substrate copper foil).
Product Introduction
JTCSLC · JDLC
Characteristic
Low profile foil products with excellent fine line shape.
Roll and sheet foils are available.
JTCSLC
Low roughness is achieved through the application of microcoarsening
High peel strength and good heat resistance
JDLC
Exhibit high peel strength in semiconductor sealing plate materials
Excellent dimensional stability
Good etching factor
Application
HDI (High Density Interconnect) board
IC seal loading plate
High layer circuit board
CAC (Aluminum substrate copper foil)
A product made by bonding four sides of a copper foil to an aluminum substrate with a thermal stripping adhesive.
Copper foil products with single or double side bonding are available.
Characteristic
It can prevent dents and folds caused by foreign matter mixing during stamping, and help to improve the yield.
Compared with SUS plate, it can increase the number of stamping input and reduce the process cost by reducing the stamping process.
Application
Printed circuit boards (mainly high layer circuit boards)
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